File:Thermal compound pl.jpg
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| Description |
English: Thermal compound, heat paste, heat transfer compound, thermal paste (...).
Titan TTG-G30030 (model no.) Nano Grease made with nanotechnology. Increasing the performance of CPU and VGA coolers. ----------------------------- SpecificationsLength 110 mm Color gray Thermal Conductivity ＞4.5 W/m-K Thermal Impedance ＜0.205°C-in2/W Specific Gravity ＞2.5 Evaporation ＜0.001% Bleed ＜0.05% Dielectric Constant A > 5.1 Dissipation Factor A < 0.005 Viscosity 76 CPS Thixotropic Index 310 ± 10°C Operation Temperture -50 ~ 240°C ----------------------------- Ingredients Silicone Compounds 50% Carbon Compounds 30% Metal Oxide Compounds 20% ----------------------------- Packing 1CTN(PCS) 400 N.W.(KGS) 12 G.W.(KGS) 16.4MEAS'T(CUFT) 3.3 Polski: Pasta termoprzewodząca, Titan TTG-G30030 (info powyżej) |
| Date | 8 June 2008 (upload date) |
| Source | Own work |
| Author | FxJ |
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I, the copyright holder of this work, release this work into the public domain. This applies worldwide. In some countries this may not be legally possible; if so: I grant anyone the right to use this work for any purpose, without any conditions, unless such conditions are required by law. |
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 15:54, 8 June 2008 | | 1,600 × 1,200 (311 KB) | FxJ (talk | contribs) | {{Information |Description={{en|1=Thermal compound, heat paste, heat transfer compound, thermal paste (...).}} {{pl|1=Pasta termoprzewodząca.}} |Source=Praca własna osoby przesyłającej (own work by uploader) |Author=FxJ |Date=8.06.2008 |P |
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