File:TPU v4.png

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Original file(2,048 × 1,536 pixels, file size: 2.68 MB, MIME type: image/png)

Captions

Captions

TPU v4

Summary[edit]

Description
English: The TPU v4 package (ASIC in center plus 4 HBM

stacks) and printed circuit board (PCB) with 4 liquid-cooled packages. The board's front panel has 4 top-side PCIe connectors

and 16 bottom-side OSFP connectors for inter-tray ICI links.
Date
Source https://arxiv.org/ftp/arxiv/papers/2304/2304.01433.pdf
Author

Norman P. Jouppi, George Kurian, Sheng Li, Peter Ma, Rahul Nagarajan, Lifeng Nai, Nishant Patil, Suvinay

Subramanian, Andy Swing, Brian Towles, Cliff Young, Xiang Zhou, Zongwei Zhou, and David Patterson
Permission
(Reusing this file)
https://arxiv.org/abs/2304.01433

Licensing[edit]

w:en:Creative Commons
attribution
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Date/TimeThumbnailDimensionsUserComment
current12:04, 6 April 2023Thumbnail for version as of 12:04, 6 April 20232,048 × 1,536 (2.68 MB)Shizhao (talk | contribs)Uploaded a work by Norman P. Jouppi, George Kurian, Sheng Li, Peter Ma, Rahul Nagarajan, Lifeng Nai, Nishant Patil, Suvinay Subramanian, Andy Swing, Brian Towles, Cliff Young, Xiang Zhou, Zongwei Zhou, and David Patterson from https://arxiv.org/ftp/arxiv/papers/2304/2304.01433.pdf with UploadWizard

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