File:B-e-ultrasonicimage.png
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Summary[edit]
| Description |
English: Ultra sonic image of a test patterned Au-Si eutectic bonded wafer. |
| Date | 30 March 2011 (original upload date) |
| Source |
Y.-C. Lin and M. Baum and M. Haubold and J. Frömel and M. Wiemer and T. Gessner and M. Esashi, Development and evaluation of AuSi eutectic wafer bonding (2009)
|
| Author | Fraunhofer ENAS, D. Neumann |
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Upload date | User | Bytes | Dimensions | Comment
- 2011-03-30 11:27 (UTC) | Enaswiki | 56875 (bytes) | 227×230 | {{Information |Description = Ultra sonic image of a blank wafer. |Source = Y.-C. Lin and M. Baum and M. Haubold and J. Frömel and M. Wiemer and T. Gessner and M. Esashi, Development and evaluation of AuSi eutectic wafer bonding (2009) |Date
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 11:04, 15 November 2011 | | 227 × 230 (56 KB) | SreeBot (talk | contribs) | (Original text) : {{Information |Description = Ultra sonic image of a blank wafer. |Source = Y.-C. Lin and M. Baum and M. Haubold and J. Frömel and M. Wiemer and T. Gessner and M. Esashi, Development and evaluation of AuSi eutectic wafer bon |
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