File:3DS die stacking concept model (DE).png
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Size of this preview: 800 × 289 pixels. Other resolutions: 320 × 115 pixels | 1,048 × 378 pixels.
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Summary[edit]
Description3DS die stacking concept model (DE).png |
English: 3DS die stacking concept model
Made by uploader (ref:JEDECが「DDR4」とTSVを使う「3DS」メモリ技術の概要を明らかに) Upload Date:2011-11-11 Deutsch: Seitenansicht eines 3D-integrierten Schaltkreis im Chipstapel-Konzept |
Date | (UTC) |
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This file was derived from: 3DS die stacking concept model.PNG: |
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This is a retouched picture, which means that it has been digitally altered from its original version. Modifications: translation; crop. The original can be viewed here: 3DS die stacking concept model.PNG: . Modifications made by Cepheiden.
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Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts. A copy of the license is included in the section entitled GNU Free Documentation License.http://www.gnu.org/copyleft/fdl.htmlGFDLGNU Free Documentation Licensetruetrue |
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Original upload log[edit]
This image is a derivative work of the following images:
- File:3DS_die_stacking_concept_model.PNG licensed with Cc-by-sa-3.0, GFDL
- 2011-11-11T09:16:54Z Shigeru23 1000x440 (66995 Bytes) 3DS die stacking concept model Made by uploader (ref:[http://pc.watch.impress.co.jp/docs/column/kaigai/20111107_488696.html JEDECが「DDR4」とTSVを使う「3DS」メモリ技術の概要を明らかに]) Upload Date:2011-
- 2011-11-11T09:16:50Z Shigeru23 1000x440 (66995 Bytes) 3DS die stacking concept model Made by uploader (ref:[http://pc.watch.impress.co.jp/docs/column/kaigai/20111107_488696.html JEDECが「DDR4」とTSVを使う「3DS」メモリ技術の概要を明らかに]) Upload Date:2011-
- 2011-11-11T09:16:47Z Shigeru23 1000x440 (66995 Bytes) 3DS die stacking concept model Made by uploader (ref:[http://pc.watch.impress.co.jp/docs/column/kaigai/20111107_488696.html JEDECが「DDR4」とTSVを使う「3DS」メモリ技術の概要を明らかに]) Upload Date:2011-
- 2011-11-11T09:16:42Z Shigeru23 1000x440 (66995 Bytes) 3DS die stacking concept model Made by uploader (ref:[http://pc.watch.impress.co.jp/docs/column/kaigai/20111107_488696.html JEDECが「DDR4」とTSVを使う「3DS」メモリ技術の概要を明らかに]) Upload Date:2011-
- 2011-11-11T09:16:39Z Shigeru23 1000x440 (66995 Bytes) 3DS die stacking concept model Made by uploader (ref:[http://pc.watch.impress.co.jp/docs/column/kaigai/20111107_488696.html JEDECが「DDR4」とTSVを使う「3DS」メモリ技術の概要を明らかに]) Upload Date:2011-
- 2011-11-11T09:16:37Z Shigeru23 1000x440 (66995 Bytes) 3DS die stacking concept model Made by uploader (ref:[http://pc.watch.impress.co.jp/docs/column/kaigai/20111107_488696.html JEDECが「DDR4」とTSVを使う「3DS」メモリ技術の概要を明らかに]) Upload Date:2011-
- 2011-11-11T09:16:33Z Shigeru23 1000x440 (66995 Bytes) 3DS die stacking concept model Made by uploader (ref:[http://pc.watch.impress.co.jp/docs/column/kaigai/20111107_488696.html JEDECが「DDR4」とTSVを使う「3DS」メモリ技術の概要を明らかに]) Upload Date:2011-
- 2011-11-11T09:16:29Z Shigeru23 1000x440 (66995 Bytes) 3DS die stacking concept model Made by uploader (ref:[http://pc.watch.impress.co.jp/docs/column/kaigai/20111107_488696.html JEDECが「DDR4」とTSVを使う「3DS」メモリ技術の概要を明らかに]) Upload Date:2011-
- 2011-11-11T09:16:25Z Shigeru23 1000x440 (66995 Bytes) 3DS die stacking concept model Made by uploader (ref:[http://pc.watch.impress.co.jp/docs/column/kaigai/20111107_488696.html JEDECが「DDR4」とTSVを使う「3DS」メモリ技術の概要を明らかに]) Upload Date:2011-
- 2011-11-11T09:16:22Z Shigeru23 1000x440 (66995 Bytes) 3DS die stacking concept model Made by uploader (ref:[http://pc.watch.impress.co.jp/docs/column/kaigai/20111107_488696.html JEDECが「DDR4」とTSVを使う「3DS」メモリ技術の概要を明らかに]) Upload Date:2011-
- 2011-11-11T09:16:18Z Shigeru23 1000x440 (66995 Bytes) 3DS die stacking concept model Made by uploader (ref:[http://pc.watch.impress.co.jp/docs/column/kaigai/20111107_488696.html JEDECが「DDR4」とTSVを使う「3DS」メモリ技術の概要を明らかに]) Upload Date:2011-
- 2011-11-11T09:16:15Z Shigeru23 1000x440 (66995 Bytes) 3DS die stacking concept model Made by uploader (ref:[http://pc.watch.impress.co.jp/docs/column/kaigai/20111107_488696.html JEDECが「DDR4」とTSVを使う「3DS」メモリ技術の概要を明らかに]) Upload Date:2011-
- 2011-11-11T09:16:12Z Shigeru23 1000x440 (66995 Bytes) 3DS die stacking concept model Made by uploader (ref:[http://pc.watch.impress.co.jp/docs/column/kaigai/20111107_488696.html JEDECが「DDR4」とTSVを使う「3DS」メモリ技術の概要を明らかに]) Upload Date:2011-
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Date/Time | Thumbnail | Dimensions | User | Comment | |
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current | 22:56, 10 February 2012 | 1,048 × 378 (27 KB) | Cepheiden (talk | contribs) | == {{int:filedesc}} == {{Information |Description=3DS die stacking concept model<br /> Made by uploader (ref:[http://pc.watch.impress.co.jp/docs/column/kaigai/20111107_488696.html JEDECが「DDR4」とTSVを使う「3DS」メモリ技術の概要を明ら |
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